스템코

Technology Held by STEMCO

Post plating technology

Overview
Technology developed by STEMCO to improve the brittleness of the Cu-Sn alloy (IMC) that occurs in the area where bending is required.
Features
· Process of printing two times
· Flexural resistance: improved bending property (> 100%)
· Eliminating the structural weakness that is vulnerable to crack by skipping Sn plating layer in bending area
· Possible to respond to both 1-Metal, 2-Metal (single side/double side)
· Improve reduced curve reliability due to pattern defect
· Hold relevant patent (applied for patent in 2015)
Specification
Avg. 1.4回 → 101.4回
The criteria for pressurized bending test for internal evaluation (30 times)
Technical applications
All areas that require bending
Relevant photos
  • Structure of the post plating cross-section based on 1-Metal
  • Results of post plating pressurized bending evaluation