스템코

Technology Held by STEMCO

FP-Coil(Fine Pitch Coil) manufacturing

Overview
Technology to replace existing wire coil, which is used in many fields such as vibration motors, speakers and AF/OIS camera module, by Fine Pitch plated coil using high-density wiring technology and lamination technology
- High-density wiring technology: Min Space 6㎛ between circuits
  • Wire Coil
  • 4Layer FP_Coil
  • 6Layer FP_Coil
Features
· Fine Pitch Patterning technology
   Manufacturing high-density/high-performance plated coil by improving design density and wiring intensity.
· Thin Film Reel to Reel flow/lamination technology
· Making actuator smaller and slimmer
Specification
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Technical applications
Many actuators including actuator for camera OIS & AF