스템코

STEMCO-owned Technology

STEMCO-owned Technology

Reel to Reel Technology

  • Punching Device

  • Coating Device

Fine Pattern

- Etching Process
min.20㎛ Pitch (mass production)
min.18㎛ Pitch (development)
- Semi Additive (2Metal)
min.18㎛ Pitch (mass production)
min.18㎛ Pitch (development)

Fine Pattern Trends

Automatic Inspection Technology

Camera resolution: 1.5㎛/pixel, 2.0㎛/pixel

Automatic Inspection Technology