스템코

STEMCO-owned Technology

STEMCO-owned Technology

Reel to Reel Technology

  • Punching Device

  • Coating Device

Fine Pattern

- Etching Process
min.18㎛ Pitch (MP)
min.16㎛ Pitch (In development)
- Semi Additive (1-Metal & 2-Metal)
min 18㎛ Pitch (MP)
min 14㎛ Pitch (ER)

Fine Pattern Trends

Automatic Inspection Technology

Camera resolution: 1.5㎛/pixel, 2.0㎛/pixel

Automatic Inspection Technology