Technology Overview & Trends
A global leader of the world display market — STEMCO
Technology Held by STEMCO
LED Chip mounting board technology
- Overview
- Flexible board for LED Chip mounting
- Features
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· Response to ㎜ ~ ㎛ Size LED Chip
· Flexible Film Substrate
· Response to both 1-Metal and 2-Metal
· Advantageous in terms of low profile, small form factor and fine pitch.
- Specification
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· Pattern Min. Pitch : 18㎛
· PI Thickness : 25/35/50㎛
- Technical applications
- LED Chip mounting board for low profile, small form factor or fine pitch