스템코

Technology Held by STEMCO

Thin-Metal Fine Pattern Etching

Overview
Applicable to various areas such as filter with metal etching
Features
· Etching solution and technology applicable to various metal types (Cu, Ni, Invar, SUS, etc.)
· Design technology customized to customer requirements (Photo Mask design, Etching Factor control, configuration control)
· Technology to control uniformity of ultra thin plate (10~20㎛) of thin plate/thick plate material (30~100㎛)
· Wide (Max. 500mm) Roll to Roll uniform etching technology
· Thin plate (Min. 10㎛) metal stress control technology
· Automatic inspection (with self defect determination technology)
Specification
· Thickness : 10㎛ ~ 100㎛
· Width : 150~500mm
Technical applications
MEMS Filter
Filter Dust filter for MEMS Microphone
Relevant photos
  • Hole(25*25㎛)
Customer Inquiry